Sony YY2987 and YY2988 Appear On Certification Site (Update 4)

We have two new Sony YY codes, YY2987 and YY2988. I do not believe this is the WF-1000XM6, as YY2988 is identified as a wireless adapter (USB). The new codes appeared on the Mexican certification website.

I suspect we are looking at a new addition to the INZONE line, could even be a replacement for the high end H9. Unless Sony has decided to include a USB adapter with the WF-1000XM6? Doubtful.

Hopefully we will see an FCC filing soon, which would help reveal what we are looking at here. 

Update 4 - May 1

The Dongle YY2988 has appeared on Canada's certification site. I would think the headset will follow shortly.

Update 3 - April 30

The headset has been certified by IMDA

Update 2 - April 29

The USB receiver has also now been certified. It will use a USB type-C connection rather than USB type-A. The dongle uses the AB1571 chip, is a 2.4Ghz connection, and this will be used for low latency gaming, with the AB1577 chip for Bluetooth.

The PCB in the dongle is about ~23 x 13 mm. so much smaller than the current INZONE USB receivers. and closer in size to the INZONE buds receiver. Below is a comparison.

YY2988 PCB (L), INZONE Buds USB receiver (R)

The shape of the PCB is almost identical. The INZONE buds used the Airoha AB1565D chip, where as the YY2988 uses the Airoha AB1571D chip. I would think the new headset will use LE Audio (LC3) for the codec, rather than a proprietary codec as the previous INZONE models use. Although that proprietary codec was also 2.4 Ghz.

Update 1 - April 28

The headset has been certified on the FCC, but not the USB receiver. The dongle is mentioned in one of the documents though, so I guess it does not need to be certified separately anymore (see update above). The label drawing reveals we are looking at a headset, and the other documents confirm it comes with noise cancellation. So I am assuming that YY2987 is replacing the high end H9 model.

The short term confidentiality ends on October 19th, but as with other previous models, these should be announced earlier, possibly closer to the end of August or early September. The battery is 3.85V but no capacity is provided.

Unlike in the previous H9, the voice/chat microphone looks like it can be detached according to the filing. Even the label drawing is missing the microphone, where as previously the H9 label drawing showed a microphone.

Detachable voice microphone

For the mass production model, it says detachable. where as the demo product will have it attached. Similarly like on other demo units where the USB cord is full integrated into the headset and cannot be removed.

The antenna documents reveal the headset is using two different Bluetooth chips, the Airoha AB1571 and AB1577AM. The former being 'onboard' while the latter being an 'FPC ANT'. 

The previous INZONE H9 also used 2 different wireless chips, the Mediatek MT2811 and NXP NXH3670UK, with the NXP chip being used for the low latency gaming mode. 

Why Sony has opted for 2 different Airoha chips is a mystery. While all previous Airoha chips were grouped individually on the website, the AB1571 and AB1577 are grouped together. This is how Airoha describes the chips:

AB157x is a Bluetooth 5.3 and LE audio certified single chip solution and contains an ARM® Cortex®-M4F application processor which can achieve high performance and power efficiency.

A Tensilica HiFi Mini processor is embedded for the I/O peripheral control, protocol stack and DSP processing functions of AB157x.

It integrate Audio codec, Hybrid Active Noise Cancellation (ANC), New generation echo cancellation and Super wideband AI noise reduction schemes improved audio quality of the voice calls on the headset products. It also supports the new generation of ambient sound, providing a more natural hear-through experience.

AB157x also supports the latest LE Audio/Auracast, enabling richer Bluetooth use cases. In addition, with AIROHA/MTK Bluetooth® High Data-rate Technology, AB1577 can transmit lossless audio to enhance audio quality and music listening.
 

The onboard antenna is on the main PCB, while the FPC antenna will attach via a small coaxial connector.

Onboard antenna - AB1571

 

FCP antenna - AB1577AM

The back of the FCP antenna has adhesive, so it is save to assume that it will be attached to some surface on the inside of the headset.

Not much else is revealed in the filing from what I can see, so now we wait for more certifications and perhaps leaks. In addition to this new headset, Sony will be releasing a a new gaming mouse and keyboard. which I have a post about here.

The headset has also been certified in Indonesia, revealing that it is made in Vietnam.

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